RF Diode Attenuator/Switch, DFN package, 2-pin surface mount. Features 50V reverse voltage, 100mA forward current, and 1.1V forward voltage at 50mA. Offers low series resistance of 0.7 Ohm at 100mA and 4.5 Ohm at 0.5mA, with 0.28pF diode capacitance. Operates across the SHF frequency range with a maximum power dissipation of 500mW and a temperature range of -65°C to 150°C.
PackageDFN
MountingSurface Mount
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Technical Specifications
NXP BAP55L,315 technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | DFN |
| Package/Case | DFN |
| Package Description | Dual Flat Package No Lead |
| Lead Shape | No Lead |
| Pin Count | 2 |
| PCB | 2 |
| Package Length (mm) | 1.02(Max) |
| Package Width (mm) | 0.62(Max) |
| Package Height (mm) | 0.47(Max) |
| Seated Plane Height (mm) | 0.5(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Type | Attenuator|Switch |
| Configuration | Single |
| Maximum Reverse Voltage | 50V |
| Maximum Forward Current | 100mA |
| Maximum Forward Voltage | 1.1@50mAV |
| Maximum Series Resistance @ Maximum IF | 0.7@100mAOhm |
| Maximum Series Resistance @ Minimum IF | [email protected]Ohm |
| Maximum Diode Capacitance | 0.28@20VpF |
| Typical Carrier Life Time | 0.28us |
| Frequency Range | SHF |
| Maximum Power Dissipation | 500mW |
| Min Operating Temperature | -65°C |
| Max Operating Temperature | 150°C |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8541100070 |
| Schedule B | 8541100070 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP BAP55L,315 Datasheet
Download the complete datasheet for NXP BAP55L,315 to view detailed technical specifications.
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