PackageSOD
MountingSurface Mount
Power135mW
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Technical Specifications
NXP BAP55LX,315 technical specifications.
General
Package/Case
SOD
Contact Plating
Tin
Diode Capacitance-Max
0.28pF
Diode Type
PIN - Single
Forward Current
100mA
Lead Free
Lead Free
Max Current Rating
100mA
Max Operating Temperature
150°C
Min Operating Temperature
-65°C
Max Power Dissipation
135mW
Mount
Surface Mount
Package Quantity
1
Packaging
Tape and Reel
Power Dissipation
135mW
Radiation Hardening
No
Reverse Voltage
50V
Reverse Voltage (DC)
50V
RoHS Compliant
Yes
Compliance
RoHS
Compliant
Datasheet
NXP BAP55LX,315 Datasheet
Download the complete datasheet for NXP BAP55LX,315 to view detailed technical specifications.
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