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Technical Specifications
NXP BAP63LX315 technical specifications.
General
Package/Case
SOD
Contact Plating
Tin
Diode Type
PIN - Single
Forward Current
100mA
Max Current Rating
100mA
Max Operating Temperature
150°C
Min Operating Temperature
-65°C
Max Power Dissipation
135mW
Mount
Surface Mount
Package Quantity
10000
Packaging
Tape and Reel
Power Dissipation
135mW
Radiation Hardening
No
Reverse Voltage
50V
Compliance
RoHS
Compliant
Datasheet
NXP BAP63LX315 Datasheet
Download the complete datasheet for NXP BAP63LX315 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.