MountingSurface Mount
Power500mW
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Technical Specifications
NXP BAP64-03,115 technical specifications.
General
Diode Capacitance-Max
0.48pF
Diode Type
PIN - Single
Forward Current
100mA
Height
1.05mm
Lead Free
Lead Free
Length
1.8mm
Max Current Rating
100mA
Max Operating Temperature
150°C
Min Operating Temperature
-65°C
Max Power Dissipation
500mW
Max Repetitive Reverse Voltage (Vrrm)
175V
Max Reverse Voltage (DC)
175V
Mount
Surface Mount
Package Quantity
1
Packaging
Tape and Reel
Power Dissipation
500mW
Radiation Hardening
No
Reach SVHC Compliant
No
Reverse Voltage
175V
Reverse Voltage (DC)
175V
RoHS Compliant
Yes
Termination
SMD/SMT
Width
1.35mm
Compliance
RoHS
Compliant
Datasheet
NXP BAP64-03,115 Datasheet
Download the complete datasheet for NXP BAP64-03,115 to view detailed technical specifications.
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