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Technical Specifications
NXP BAP64-05W,135 technical specifications.
General
Package/Case
SOT-323
Contact Plating
Tin, Matte
Forward Current
100mA
Max Current Rating
100mA
Max Operating Temperature
150°C
Min Operating Temperature
-65°C
Max Power Dissipation
240mW
Mount
Surface Mount
Package Quantity
10000
Packaging
Tape and Reel
Power Dissipation
240mW
Radiation Hardening
No
Reverse Voltage
100V
RoHS Compliant
Yes
Termination
Solder
Compliance
RoHS
Compliant
Datasheet
NXP BAP64-05W,135 Datasheet
Download the complete datasheet for NXP BAP64-05W,135 to view detailed technical specifications.
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