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Technical Specifications
NXP BAP65-02,135 technical specifications.
General
| Contact Plating | Tin, Matte |
| Diode Type | PIN - Single |
| Forward Current | 100mA |
| Max Current Rating | 100mA |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Max Power Dissipation | 715mW |
| Max Reverse Current | 20nA |
| Mount | Surface Mount |
| Package Quantity | 10000 |
| Packaging | Tape and Reel |
| Power Dissipation | 715mW |
| Reverse Voltage | 30V |
| RoHS Compliant | Yes |
| Termination | Solder |
Compliance
| RoHS | Compliant |
Datasheet
NXP BAP65-02,135 Datasheet
Download the complete datasheet for NXP BAP65-02,135 to view detailed technical specifications.
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