The BAP65-03,115 is a PIN single diode with a maximum operating temperature of 150°C and a minimum operating temperature of -65°C. It has a maximum power dissipation of 500mW and a maximum reverse voltage of 30V. The diode is surface mountable and has a tin contact plating. It is lead-free and RoHS compliant.
MountingSurface Mount
Power500mW
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Technical Specifications
NXP BAP65-03,115 technical specifications.
General
| Contact Plating | Tin |
| Diode Capacitance-Max | 0.375pF |
| Diode Type | PIN - Single |
| Forward Current | 100mA |
| Lead Free | Lead Free |
| Max Current Rating | 100mA |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -65°C |
| Max Power Dissipation | 500mW |
| Max Repetitive Reverse Voltage (Vrrm) | 30V |
| Max Reverse Voltage (DC) | 30V |
| Mount | Surface Mount |
| Package Quantity | 3000 |
| Packaging | Tape and Reel |
| Power Dissipation | 500mW |
| Radiation Hardening | No |
| Reach SVHC Compliant | No |
| Reverse Voltage | 30V |
| Reverse Voltage (DC) | 30V |
| RoHS Compliant | Yes |
| Termination | SMD/SMT |
Compliance
| RoHS | Compliant |
Datasheet
NXP BAP65-03,115 Datasheet
Download the complete datasheet for NXP BAP65-03,115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.