
Surface mount RF PIN diode attenuator, 50V reverse voltage, 100mA forward current. Features a 2-pin SOD-523 plastic package with flat leads, measuring 1.25mm max length, 0.85mm max width, and 0.65mm max height. Offers a maximum forward voltage of 1.1V at 50mA, with series resistance of 1.9 Ohms at 100mA and 100 Ohms at 0.5mA. Maximum diode capacitance is 0.25pF at 20V, with a typical carrier lifetime of 1.25µs. Operates across a temperature range of -65°C to 150°C, with a maximum power dissipation of 415mW.
NXP BAP70-02/A2,115 technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOD |
| Package/Case | SOD-523 |
| Package Description | Small Outline Diode Package |
| Lead Shape | Flat |
| Pin Count | 2 |
| PCB | 2 |
| Package Length (mm) | 1.25(Max) |
| Package Width (mm) | 0.85(Max) |
| Package Height (mm) | 0.65(Max) |
| Seated Plane Height (mm) | 0.65(Max) |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | SOD-523 |
| Type | Attenuator |
| Configuration | Single |
| Maximum Reverse Voltage | 50V |
| Maximum Forward Current | 100mA |
| Maximum Forward Voltage | 1.1@50mAV |
| Maximum Series Resistance @ Maximum IF | 1.9@100mAOhm |
| Maximum Series Resistance @ Minimum IF | [email protected]Ohm |
| Maximum Diode Capacitance | 0.25@20VpF |
| Typical Carrier Life Time | 1.25us |
| Maximum Power Dissipation | 415mW |
| Min Operating Temperature | -65°C |
| Max Operating Temperature | 150°C |
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8541100070 |
| Schedule B | 8541100070 |
| ECCN | EAR99 |
| Automotive | Yes |
| AEC Qualified | Yes |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for NXP BAP70-02/A2,115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.