Surface mount RF PIN diode attenuator, 50V reverse voltage, 100mA forward current. Features a 2-pin SOD-523 plastic package with flat leads, measuring 1.25mm max length, 0.85mm max width, and 0.65mm max height. Offers a maximum forward voltage of 1.1V at 50mA, with series resistance of 1.9 Ohms at 100mA and 100 Ohms at 0.5mA. Maximum diode capacitance is 0.25pF at 20V, with a typical carrier lifetime of 1.25µs. Operates across a temperature range of -65°C to 150°C, with a maximum power dissipation of 415mW.
PackageSOD-523
MountingSurface Mount
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Technical Specifications
NXP BAP70-02/A2,115 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOD
Package/Case
SOD-523
Package Description
Small Outline Diode Package
Lead Shape
Flat
Pin Count
2
PCB
2
Package Length (mm)
1.25(Max)
Package Width (mm)
0.85(Max)
Package Height (mm)
0.65(Max)
Seated Plane Height (mm)
0.65(Max)
Package Material
Plastic
Mounting
Surface Mount
Jedec
SOD-523
Type
Attenuator
Configuration
Single
Maximum Reverse Voltage
50V
Maximum Forward Current
100mA
Maximum Forward Voltage
1.1@50mAV
Maximum Series Resistance @ Maximum IF
1.9@100mAOhm
Maximum Series Resistance @ Minimum IF
Maximum Diode Capacitance
0.25@20VpF
Typical Carrier Life Time
1.25us
Maximum Power Dissipation
415mW
Min Operating Temperature
-65°C
Max Operating Temperature
150°C
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8541100070
Schedule B
8541100070
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP BAP70-02/A2,115 Datasheet
Download the complete datasheet for NXP BAP70-02/A2,115 to view detailed technical specifications.
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