RF PIN Attenuator diode, single configuration, designed for surface mount applications. Features a 2-pin SOD-323 plastic package with gull-wing leads, measuring 1.8mm (L) x 1.35mm (W) x 1.05mm (H). Operates with a maximum reverse voltage of 50V and a maximum forward current of 100mA. Exhibits a maximum forward voltage of 1.1V at 50mA and a maximum series resistance of 1.9 Ohms at 100mA. Maximum diode capacitance is 0.25pF at 20V, with a typical carrier lifetime of 1.25µs. Power dissipation is rated at 500mW, with an operating temperature range of -65°C to 150°C.
PackageSOD-323
MountingSurface Mount
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Technical Specifications
NXP BAP70-03/A2,115 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOD
Package/Case
SOD-323
Package Description
Small Outline Diode Package
Lead Shape
Gull-wing
Pin Count
2
PCB
2
Package Length (mm)
1.8(Max)
Package Width (mm)
1.35(Max)
Package Height (mm)
1.05(Max)
Seated Plane Height (mm)
1.1(Max)
Package Material
Plastic
Mounting
Surface Mount
Jedec
SOD-323
Type
Attenuator
Configuration
Single
Maximum Reverse Voltage
50V
Maximum Forward Current
100mA
Maximum Forward Voltage
1.1@50mAV
Maximum Series Resistance @ Maximum IF
1.9@100mAOhm
Maximum Series Resistance @ Minimum IF
Maximum Diode Capacitance
0.25@20VpF
Typical Carrier Life Time
1.25us
Maximum Power Dissipation
500mW
Min Operating Temperature
-65°C
Max Operating Temperature
150°C
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8541100070
Schedule B
8541100070
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP BAP70-03/A2,115 Datasheet
Download the complete datasheet for NXP BAP70-03/A2,115 to view detailed technical specifications.
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