RF PIN Attenuator diode, single configuration, designed for surface mount applications. Features a 2-pin SOD-323 plastic package with gull-wing leads, measuring 1.8mm (L) x 1.35mm (W) x 1.05mm (H). Operates with a maximum reverse voltage of 50V and a maximum forward current of 100mA. Exhibits a maximum forward voltage of 1.1V at 50mA and a maximum series resistance of 1.9 Ohms at 100mA. Maximum diode capacitance is 0.25pF at 20V, with a typical carrier lifetime of 1.25µs. Power dissipation is rated at 500mW, with an operating temperature range of -65°C to 150°C.
PackageSOD-323
MountingSurface Mount
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Technical Specifications
NXP BAP70-03/A2,115 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOD |
| Package/Case | SOD-323 |
| Package Description | Small Outline Diode Package |
| Lead Shape | Gull-wing |
| Pin Count | 2 |
| PCB | 2 |
| Package Length (mm) | 1.8(Max) |
| Package Width (mm) | 1.35(Max) |
| Package Height (mm) | 1.05(Max) |
| Seated Plane Height (mm) | 1.1(Max) |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | SOD-323 |
| Type | Attenuator |
| Configuration | Single |
| Maximum Reverse Voltage | 50V |
| Maximum Forward Current | 100mA |
| Maximum Forward Voltage | 1.1@50mAV |
| Maximum Series Resistance @ Maximum IF | 1.9@100mAOhm |
| Maximum Series Resistance @ Minimum IF | [email protected]Ohm |
| Maximum Diode Capacitance | 0.25@20VpF |
| Typical Carrier Life Time | 1.25us |
| Maximum Power Dissipation | 500mW |
| Min Operating Temperature | -65°C |
| Max Operating Temperature | 150°C |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8541100070 |
| Schedule B | 8541100070 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP BAP70-03/A2,115 Datasheet
Download the complete datasheet for NXP BAP70-03/A2,115 to view detailed technical specifications.
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