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Technical Specifications
NXP BAP70AM,115 technical specifications.
General
| Package/Case | TSSOP |
| Contact Plating | Tin, Matte |
| Forward Current | 100mA |
| Max Current Rating | 100mA |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -65°C |
| Max Power Dissipation | 300mW |
| Mount | Surface Mount |
| Package Quantity | 3000 |
| Packaging | Tape and Reel |
| Power Dissipation | 300mW |
| Radiation Hardening | No |
| Reverse Voltage | 50V |
| Reverse Voltage (DC) | 50V |
| RoHS Compliant | Yes |
Compliance
| RoHS | Compliant |
Datasheet
NXP BAP70AM,115 Datasheet
Download the complete datasheet for NXP BAP70AM,115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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