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Technical Specifications
NXP BAP70AM,135 technical specifications.
General
Package/Case
TSSOP
Contact Plating
Tin, Matte
Forward Current
100mA
Max Current Rating
100mA
Max Operating Temperature
150°C
Min Operating Temperature
-65°C
Max Power Dissipation
300mW
Mount
Surface Mount
Package Quantity
10000
Packaging
Tape and Reel
Power Dissipation
300mW
Reverse Voltage
50V
RoHS Compliant
Yes
Termination
SMD/SMT
Compliance
RoHS
Compliant
Datasheet
NXP BAP70AM,135 Datasheet
Download the complete datasheet for NXP BAP70AM,135 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.