MountingSurface Mount
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Technical Specifications
NXP BAS86115 technical specifications.
General
| Average Rectified Current | 200mA |
| Contact Plating | Tin |
| Element Configuration | Single |
| Forward Current | 200mA |
| Height | 1.6mm |
| Lead Free | Lead Free |
| Length | 3.7mm |
| Max Forward Surge Current (Ifsm) | 5A |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -65°C |
| Max Repetitive Reverse Voltage (Vrrm) | 50V |
| Max Reverse Current | 5uA |
| Max Reverse Leakage Current | 5uA |
| Max Reverse Voltage (DC) | 50V |
| Max Surge Current | 5A |
| Mount | Surface Mount |
| Peak Non-Repetitive Surge Current | 5A |
| Radiation Hardening | No |
| Reach SVHC Compliant | No |
| Reverse Recovery Time | 4ns |
| Weight | 4.535924g |
| Width | 1.6mm |
Compliance
| RoHS | Not CompliantNo |
Datasheet
NXP BAS86115 Datasheet
Download the complete datasheet for NXP BAS86115 to view detailed technical specifications.
No datasheet is available for this part.