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Technical Specifications
NXP BB149,115 technical specifications.
General
Capacitance
18pF
Contact Plating
Tin
Height
1.05mm
Lead Free
Lead Free
Length
1.8mm
Max Operating Temperature
125°C
Min Operating Temperature
-55°C
Mount
Surface Mount
Package Quantity
3000
Packaging
Tape and Reel
Radiation Hardening
No
Reverse Voltage (DC)
30V
RoHS Compliant
Yes
Width
1.35mm
Compliance
RoHS
Compliant
Datasheet
NXP BB149,115 Datasheet
Download the complete datasheet for NXP BB149,115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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