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Technical Specifications
NXP BB153,135 technical specifications.
General
Capacitance
34.65pF
Contact Plating
Tin
Lead Free
Lead Free
Max Operating Temperature
125°C
Min Operating Temperature
-55°C
Mount
Surface Mount
Package Quantity
10000
Packaging
Tape and Reel
Reverse Voltage (DC)
32V
RoHS Compliant
Yes
Compliance
RoHS
Compliant
Datasheet
NXP BB153,135 Datasheet
Download the complete datasheet for NXP BB153,135 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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