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Technical Specifications
NXP BB156/A2,115 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOD
Package/Case
SOD-323
Package Description
Small Outline Diode Package
Lead Shape
Gull-wing
Pin Count
2
PCB
2
Package Length (mm)
1.8(Max)
Package Width (mm)
1.35(Max)
Package Height (mm)
1.05(Max)
Seated Plane Height (mm)
1.1(Max)
Package Material
Plastic
Mounting
Surface Mount
Jedec
SOD-323
Type
VCO
Configuration
Single
Maximum Reverse Voltage
10V
Minimum Tuning Ratio
2.7
Tuning Ratio Test Condition
1V/7.5V
Minimum Diode Capacitance
14.4@1VpF
Min Operating Temperature
-55°C
Max Operating Temperature
125°C
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8541100070
Schedule B
8541100070
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP BB156/A2,115 Datasheet
Download the complete datasheet for NXP BB156/A2,115 to view detailed technical specifications.
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