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Technical Specifications
NXP BB156/A2,115 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOD |
| Package/Case | SOD-323 |
| Package Description | Small Outline Diode Package |
| Lead Shape | Gull-wing |
| Pin Count | 2 |
| PCB | 2 |
| Package Length (mm) | 1.8(Max) |
| Package Width (mm) | 1.35(Max) |
| Package Height (mm) | 1.05(Max) |
| Seated Plane Height (mm) | 1.1(Max) |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | SOD-323 |
| Type | VCO |
| Configuration | Single |
| Maximum Reverse Voltage | 10V |
| Minimum Tuning Ratio | 2.7 |
| Tuning Ratio Test Condition | 1V/7.5V |
| Minimum Diode Capacitance | 14.4@1VpF |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 125°C |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8541100070 |
| Schedule B | 8541100070 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP BB156/A2,115 Datasheet
Download the complete datasheet for NXP BB156/A2,115 to view detailed technical specifications.
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