PackageSOD-323-2
Capacitance2.6pF
MountingSurface Mount
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Technical Specifications
NXP BB170X technical specifications.
General
Capacitance
2.6pF
Package/Case
SOD-323-2
Contact Plating
Tin
Forward Current
20mA
Max Operating Temperature
125°C
Min Operating Temperature
-55°C
Mount
Surface Mount
Package Quantity
3000
Packaging
Tape and Reel
Reverse Voltage (DC)
30V
RoHS Compliant
Yes
Termination
SMD/SMT
Compliance
RoHS
Compliant
Datasheet
NXP BB170X Datasheet
Download the complete datasheet for NXP BB170X to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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