PackageSOD-523-2
Capacitance2.1pF
MountingSurface Mount
Quick Jump:
Technical Specifications
NXP BB174X technical specifications.
General
Capacitance
2.1pF
Package/Case
SOD-523-2
Contact Plating
Tin
Forward Current
20mA
Max Operating Temperature
125°C
Min Operating Temperature
-55°C
Mount
Surface Mount
Package Quantity
3000
Packaging
Tape and Reel
Reverse Voltage
30V
RoHS Compliant
Yes
Termination
SMD/SMT
Compliance
RoHS
Compliant
Datasheet
NXP BB174X Datasheet
Download the complete datasheet for NXP BB174X to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.