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Technical Specifications
NXP BB174X technical specifications.
General
| Capacitance | 2.1pF |
| Package/Case | SOD-523-2 |
| Contact Plating | Tin |
| Forward Current | 20mA |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -55°C |
| Mount | Surface Mount |
| Package Quantity | 3000 |
| Packaging | Tape and Reel |
| Reverse Voltage | 30V |
| RoHS Compliant | Yes |
| Termination | SMD/SMT |
Compliance
| RoHS | Compliant |
Datasheet
NXP BB174X Datasheet
Download the complete datasheet for NXP BB174X to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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