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Technical Specifications
NXP BB178115 technical specifications.
General
Capacitance
34.65pF
Contact Plating
Tin
Diode Capacitance-Max
2.754pF
Diode Type
VARIABLE CAPACITANCE
Forward Current
20mA
Height
0.65mm
Lead Free
Lead Free
Length
1.25mm
Max Operating Temperature
125°C
Min Operating Temperature
-55°C
Max Repetitive Reverse Voltage (Vrrm)
35V
Max Reverse Voltage (DC)
32V
Mount
Surface Mount
Package Quantity
1
Packaging
Tape and Reel
Radiation Hardening
No
Reach SVHC Compliant
No
Reverse Voltage (DC)
32V
Termination
SMD/SMT
Width
0.85mm
Compliance
RoHS
Compliant
Datasheet
NXP BB178115 Datasheet
Download the complete datasheet for NXP BB178115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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