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Technical Specifications
NXP BB178LX315 technical specifications.
General
Capacitance
34.65pF
Package/Case
SOD
Contact Plating
Tin
Lead Free
Lead Free
Max Operating Temperature
125°C
Min Operating Temperature
-55°C
Mount
Surface Mount
Package Quantity
10000
Packaging
Tape and Reel
Reverse Voltage
32V
Compliance
RoHS
Compliant
Datasheet
NXP BB178LX315 Datasheet
Download the complete datasheet for NXP BB178LX315 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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