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Technical Specifications
NXP BB179,315 technical specifications.
General
Capacitance
21.26pF
Contact Plating
Tin
Forward Current
20mA
Max Operating Temperature
125°C
Min Operating Temperature
-55°C
Mount
Surface Mount
Package Quantity
8000
Packaging
Tape and Reel
Radiation Hardening
No
Reverse Voltage (DC)
30V
RoHS Compliant
Yes
Termination
SMD/SMT
Compliance
RoHS
Compliant
Datasheet
NXP BB179,315 Datasheet
Download the complete datasheet for NXP BB179,315 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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