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Technical Specifications
NXP BB179LX,315 technical specifications.
General
| Capacitance | 18.2pF |
| Package/Case | SOD |
| Contact Plating | Tin |
| Lead Free | Lead Free |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -55°C |
| Mount | Surface Mount |
| Package Quantity | 10000 |
| Packaging | Tape and Reel |
| Radiation Hardening | No |
| Reverse Voltage (DC) | 30V |
| RoHS Compliant | Yes |
Compliance
| RoHS | Compliant |
Datasheet
NXP BB179LX,315 Datasheet
Download the complete datasheet for NXP BB179LX,315 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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