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Technical Specifications
NXP BB182,115 technical specifications.
General
| Capacitance | 52pF |
| Contact Plating | Tin |
| Diode Capacitance-Max | 2.89pF |
| Diode Type | VARIABLE CAPACITANCE |
| Forward Current | 20mA |
| Height | 0.65mm |
| Lead Free | Lead Free |
| Length | 1.25mm |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -55°C |
| Max Repetitive Reverse Voltage (Vrrm) | 35V |
| Max Reverse Voltage (DC) | 32V |
| Mount | Surface Mount |
| Package Quantity | 1 |
| Packaging | Tape and Reel |
| Radiation Hardening | No |
| Reach SVHC Compliant | No |
| Reverse Voltage (DC) | 32V |
| RoHS Compliant | Yes |
| Termination | SMD/SMT |
| Width | 0.85mm |
Compliance
| RoHS | Compliant |
Datasheet
NXP BB182,115 Datasheet
Download the complete datasheet for NXP BB182,115 to view detailed technical specifications.
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