Quick Jump:
Technical Specifications
NXP BB182135 technical specifications.
General
| Capacitance | 62pF |
| Contact Plating | Tin, Matte |
| Forward Current | 20mA |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -55°C |
| Mount | Surface Mount |
| Package Quantity | 10000 |
| Packaging | Tape and Reel |
| Reverse Voltage (DC) | 32V |
| Termination | SMD/SMT |
Compliance
| RoHS | Compliant |
Datasheet
NXP BB182135 Datasheet
Download the complete datasheet for NXP BB182135 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
Product Images
