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Technical Specifications
NXP BB184115 technical specifications.
General
Capacitance
12.7pF
Contact Plating
Tin
Diode Capacitance-Max
15.3pF
Height
0.65mm
Lead Free
Lead Free
Length
1.25mm
Max Operating Temperature
125°C
Min Operating Temperature
-55°C
Mount
Surface Mount
Package Quantity
1
Packaging
Tape and Reel
Radiation Hardening
No
Reverse Voltage (DC)
13V
Width
0.85mm
Compliance
RoHS
Compliant
Datasheet
NXP BB184115 Datasheet
Download the complete datasheet for NXP BB184115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.