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Technical Specifications
NXP BB187335 technical specifications.
General
Capacitance
34.2pF
Contact Plating
Tin, Matte
Forward Current
20mA
Max Operating Temperature
125°C
Min Operating Temperature
-55°C
Mount
Surface Mount
Package Quantity
20000
Packaging
Tape and Reel
Reverse Voltage (DC)
32V
Termination
SMD/SMT
Compliance
RoHS
Compliant
Datasheet
NXP BB187335 Datasheet
Download the complete datasheet for NXP BB187335 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.