Quick Jump:
Technical Specifications
NXP BB189315 technical specifications.
General
Capacitance
15.75pF
Contact Plating
Tin
Forward Current
20mA
Max Operating Temperature
125°C
Min Operating Temperature
-55°C
Mount
Surface Mount
Package Quantity
8000
Packaging
Tape and Reel
Reverse Voltage (DC)
32V
Termination
SMD/SMT
Compliance
RoHS
Compliant
Datasheet
NXP BB189315 Datasheet
Download the complete datasheet for NXP BB189315 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.