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Technical Specifications
NXP BB198,115 technical specifications.
General
| Capacitance | 28.5pF |
| Contact Plating | Tin |
| Mount | Surface Mount |
| Package Quantity | 3000 |
| Packaging | Tape and Reel |
| Reverse Voltage | 20V |
| RoHS Compliant | Yes |
| Termination | SMD/SMT |
Compliance
| RoHS | Compliant |
Datasheet
NXP BB198,115 Datasheet
Download the complete datasheet for NXP BB198,115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.