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Technical Specifications
NXP BB199,115 technical specifications.
General
Capacitance
42.5pF
Contact Plating
Tin
Max Operating Temperature
150°C
Min Operating Temperature
-65°C
Mount
Surface Mount
Package Quantity
3000
Packaging
Tape and Reel
Radiation Hardening
No
Reverse Voltage
20V
RoHS Compliant
Yes
Termination
SMD/SMT
Compliance
RoHS
Compliant
Datasheet
NXP BB199,115 Datasheet
Download the complete datasheet for NXP BB199,115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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