Capacitance19.9pF
MountingSurface Mount
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Technical Specifications
NXP BB208-02,115 technical specifications.
General
Capacitance
19.9pF
Contact Plating
Tin
Forward Current
20mA
Height
0.65mm
Length
1.25mm
Max Operating Temperature
125°C
Min Operating Temperature
-55°C
Mount
Surface Mount
Package Quantity
3000
Packaging
Tape and Reel
Radiation Hardening
No
Reverse Voltage (DC)
10V
RoHS Compliant
Yes
Termination
SMD/SMT
Width
0.85mm
Compliance
RoHS
Compliant
Datasheet
NXP BB208-02,115 Datasheet
Download the complete datasheet for NXP BB208-02,115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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