PackageTO-236AB
Capacitance32pF
MountingSurface Mount
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Technical Specifications
NXP BBY40,235 technical specifications.
General
Capacitance
32pF
Package/Case
TO-236AB
Contact Plating
Tin, Matte
Forward Current
20mA
Max Operating Temperature
125°C
Min Operating Temperature
-55°C
Mount
Surface Mount
Package Quantity
10000
Packaging
Tape and Reel
Radiation Hardening
No
Reverse Voltage (DC)
30V
Termination
SMD/SMT
Compliance
RoHS
Compliant
Datasheet
NXP BBY40,235 Datasheet
Download the complete datasheet for NXP BBY40,235 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.