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Technical Specifications
NXP BF1108,215 technical specifications.
General
| Package/Case | TO-253-4 |
| Contact Plating | Tin, Matte |
| Continuous Drain Current (ID) | 10mA |
| Current Rating | 10mA |
| Lead Free | Lead Free |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -65°C |
| Mount | Surface Mount |
| Number of Elements | 1 |
| Package Quantity | 1 |
| Packaging | Cut Tape |
| RoHS Compliant | Yes |
| Voltage Rating | 3V |
Compliance
| RoHS | Compliant |
Datasheet
NXP BF1108,215 Datasheet
Download the complete datasheet for NXP BF1108,215 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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