Quick Jump:
Technical Specifications
NXP BF1108R,215 technical specifications.
General
| Contact Plating | Tin, Matte |
| Continuous Drain Current (ID) | 10mA |
| Current Rating | 10mA |
| Drain to Source Resistance | 20R |
| Drain to Source Voltage (Vdss) | 3V |
| DS Breakdown Voltage-Min | 3V |
| Gate to Source Voltage (Vgs) | 7V |
| Height | 1mm |
| Lead Free | Lead Free |
| Length | 3mm |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -65°C |
| Mount | Surface Mount |
| Number of Channels | 1 |
| Number of Elements | 1 |
| Package Quantity | 1 |
| Packaging | Tape and Reel |
| Polarity | N-CHANNEL |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Voltage Rating | 3V |
| Width | 1.4mm |
Compliance
| RoHS | Compliant |
Datasheet
NXP BF1108R,215 Datasheet
Download the complete datasheet for NXP BF1108R,215 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
Product Images
