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Technical Specifications
NXP BF556B 215 technical specifications.
General
| Package/Case | TO-236AB |
| Contact Plating | Tin |
| Continuous Drain Current (ID) | 13mA |
| Current Rating | 13mA |
| Drain to Source Voltage (Vdss) | 30V |
| Gate to Source Voltage (Vgs) | -30V |
| Height | 1mm |
| Length | 3mm |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -65°C |
| Max Power Dissipation | 250mW |
| Mount | Surface Mount |
| Package Quantity | 3000 |
| Packaging | Tape and Reel |
| Polarity | N-CHANNEL |
| Radiation Hardening | No |
| Voltage Rating | 30V |
| Weight | 0.00709oz |
| Width | 1.4mm |
Compliance
| RoHS | Compliant |
Datasheet
NXP BF556B 215 Datasheet
Download the complete datasheet for NXP BF556B 215 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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