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Technical Specifications
NXP BF862,215 technical specifications.
General
| Package/Case | TO-236AB |
| Continuous Drain Current (ID) | 40mA |
| Current Rating | 25mA |
| Drain to Source Voltage (Vdss) | 20V |
| FET Technology | JUNCTION |
| Gate to Source Voltage (Vgs) | -1.2V |
| Height | 1mm |
| Lead Free | Lead Free |
| Length | 3mm |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -65°C |
| Max Power Dissipation | 300mW |
| Mount | Surface Mount |
| Number of Elements | 1 |
| Package Quantity | 1 |
| Packaging | Cut Tape |
| Power Dissipation | 300mW |
| Reach SVHC Compliant | No |
| RoHS Compliant | Yes |
| Termination | SMD/SMT |
| Voltage Rating | 20V |
| Width | 1.4mm |
Compliance
| RoHS | Compliant |
Datasheet
NXP BF862,215 Datasheet
Download the complete datasheet for NXP BF862,215 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.