The BFS17/FD,215 is a small outline transistor packaged in a TO-236AB lead-frame SMT package with a gull-wing lead shape. It has a maximum package length of 3mm, width of 1.4mm, and height of 1mm. The seated plane height is 1.1mm with a pin pitch of 0.95mm. This surface-mount transistor is made of plastic and has 3 pins on the PCB.
PackageTO-236AB
MountingSurface Mount
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Technical Specifications
NXP BFS17/FD,215 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOT-23 |
| Package/Case | TO-236AB |
| Package Description | Small Outline Transistor |
| Lead Shape | Gull-wing |
| Pin Count | 3 |
| PCB | 3 |
| Package Length (mm) | 3(Max) |
| Package Width (mm) | 1.4(Max) |
| Package Height (mm) | 1(Max) |
| Seated Plane Height (mm) | 1.1(Max) |
| Pin Pitch (mm) | 0.95 |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP BFS17/FD,215 Datasheet
Download the complete datasheet for NXP BFS17/FD,215 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.