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Technical Specifications
NXP BGA2002,115 technical specifications.
General
Contact Plating
Tin
Gain
19.5dB
Max Frequency
2.2GHz
Max Operating Temperature
150°C
Max Power Dissipation
135mW
Max Supply Voltage
4.5V
Mount
Surface Mount
Noise Figure
1.3dB
Number of Channels
1
Operating Frequency
0 Hz to 2.2 GHz
Operating Supply Current
4.5mA
Operating Supply Voltage
2.5V
P1dB
-2dBm
Package Quantity
3000
Packaging
Tape and Reel
Power Dissipation
135mW
Radiation Hardening
No
RoHS Compliant
Yes
Supply Current
4.5mA
Test Frequency
1.8GHz
Compliance
RoHS
Compliant
Datasheet
NXP BGA2002,115 Datasheet
Download the complete datasheet for NXP BGA2002,115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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