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Technical Specifications
NXP BGA2003-115 technical specifications.
General
Contact Plating
Tin
Frequency
1.8GHz
Gain
16dB
Max Operating Temperature
150°C
Max Power Dissipation
135mW
Max Supply Voltage
4.5V
Mount
Surface Mount
Noise Figure
2dB
Number of Channels
1
Operating Frequency
900 MHz to 1.8 GHz
Operating Supply Current
30mA
Operating Supply Voltage
2.5V
Package Quantity
1
Packaging
Tape and Reel
Power Dissipation
135mW
Radiation Hardening
No
Supply Current
11mA
Test Frequency
900MHz
Compliance
RoHS
Compliant
Datasheet
NXP BGA2003-115 Datasheet
Download the complete datasheet for NXP BGA2003-115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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