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Technical Specifications
NXP BGA2011,115 technical specifications.
General
| Package/Case | SOT-363 |
| Contact Plating | Tin |
| Frequency | 900MHz |
| Gain | 19dB |
| Max Frequency | 900MHz |
| Max Operating Temperature | 150°C |
| Max Power Dissipation | 135mW |
| Max Supply Voltage | 4.5V |
| Mount | Surface Mount |
| Noise Figure | 1.5dB |
| Number of Channels | 1 |
| Operating Frequency | 900 MHz |
| Operating Supply Current | 20mA |
| Operating Supply Voltage | 3V |
| P1dB | 10dBm |
| Package Quantity | 1 |
| Packaging | Tape and Reel |
| Power Dissipation | 135mW |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Supply Current | 15mA |
| Test Frequency | 900MHz |
Compliance
| RoHS | Compliant |
Datasheet
NXP BGA2011,115 Datasheet
Download the complete datasheet for NXP BGA2011,115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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