Frequency100 MHz to 3 GHz
PackageTSSOP
Current4.58mA
MountingSurface Mount
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Technical Specifications
NXP BGA2714,115 technical specifications.
General
Package/Case
TSSOP
Contact Plating
Tin
Gain
20.8dB
Lead Free
Lead Free
Max Operating Temperature
150°C
Max Power Dissipation
200mW
Max Supply Voltage
4V
Mount
Surface Mount
Noise Figure
2.2dB
Number of Channels
1
Operating Frequency
100 MHz to 3 GHz
Operating Supply Current
10mA
Operating Supply Voltage
3V
P1dB
-9dBm
Package Quantity
3000
Packaging
Tape and Reel
Power Dissipation
200mW
Radiation Hardening
No
RoHS Compliant
Yes
Supply Current
4.58mA
Test Frequency
2.7GHz
Compliance
RoHS
Compliant
Datasheet
NXP BGA2714,115 Datasheet
Download the complete datasheet for NXP BGA2714,115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.