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Technical Specifications
NXP BGA2714,115 technical specifications.
General
| Package/Case | TSSOP |
| Contact Plating | Tin |
| Gain | 20.8dB |
| Lead Free | Lead Free |
| Max Operating Temperature | 150°C |
| Max Power Dissipation | 200mW |
| Max Supply Voltage | 4V |
| Mount | Surface Mount |
| Noise Figure | 2.2dB |
| Number of Channels | 1 |
| Operating Frequency | 100 MHz to 3 GHz |
| Operating Supply Current | 10mA |
| Operating Supply Voltage | 3V |
| P1dB | -9dBm |
| Package Quantity | 3000 |
| Packaging | Tape and Reel |
| Power Dissipation | 200mW |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Supply Current | 4.58mA |
| Test Frequency | 2.7GHz |
Compliance
| RoHS | Compliant |
Datasheet
NXP BGA2714,115 Datasheet
Download the complete datasheet for NXP BGA2714,115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.