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Technical Specifications
NXP BGA2716115 technical specifications.
General
Package/Case
SOT-363
Contact Plating
Tin
Frequency
50MHz
Gain
22.9dB
Lead Free
Lead Free
Max Power Dissipation
200mW
Max Supply Voltage
6V
Mount
Surface Mount
Noise Figure
5.3dB
Operating Supply Current
15.9mA
Operating Supply Voltage
5V
P1dB
8.9dBm
Package Quantity
1
Packaging
Tape and Reel
Radiation Hardening
No
Supply Current
21mA
Test Frequency
1GHz
Weight
0.000212oz
Compliance
RoHS
Compliant
Datasheet
NXP BGA2716115 Datasheet
Download the complete datasheet for NXP BGA2716115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.