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Technical Specifications
NXP BGA2716115 technical specifications.
General
| Package/Case | SOT-363 |
| Contact Plating | Tin |
| Frequency | 50MHz |
| Gain | 22.9dB |
| Lead Free | Lead Free |
| Max Power Dissipation | 200mW |
| Max Supply Voltage | 6V |
| Mount | Surface Mount |
| Noise Figure | 5.3dB |
| Operating Supply Current | 15.9mA |
| Operating Supply Voltage | 5V |
| P1dB | 8.9dBm |
| Package Quantity | 1 |
| Packaging | Tape and Reel |
| Radiation Hardening | No |
| Supply Current | 21mA |
| Test Frequency | 1GHz |
| Weight | 0.000212oz |
Compliance
| RoHS | Compliant |
Datasheet
NXP BGA2716115 Datasheet
Download the complete datasheet for NXP BGA2716115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.