Quick Jump:
Technical Specifications
NXP BGE788,112 technical specifications.
General
Package/Case
SFM
Pin Count
7
PCB
7
Package Length (mm)
44.75(Max)
Package Width (mm)
13.75(Max)
Package Height (mm)
20.8(Max)
Seated Plane Height (mm)
20.8(Max)
Mounting
Screw
Number of Elements per Chip
1
Maximum Operating Frequency
750MHz
Maximum CTB @ Test Conditions
-49dB
Maximum Xmod @ Test Conditions
-51dB
Maximum CSO @ Test Conditions
-52dB
Maximum Power Gain @ Maximum Frequency
34.5@50MHzdB
Maximum Gain Flatness @ Maximum Frequency
±0.5dB
Compliance
Cage Code
H1R01
EU RoHS
Yes with Exemption
HTS Code
8542330001
Schedule B
8542330000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP BGE788,112 Datasheet
Download the complete datasheet for NXP BGE788,112 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.