Surface mount modulator IC featuring a 24-pin HVQFN EP package with thermal enhancement and exposed pad. Operates up to 4000 MHz with a typical output power of 20 dBm. Designed for surface mounting, this plastic package has a 0.5mm pin pitch and measures 4.1mm x 4.1mm x 0.95mm. Supply voltage ranges from 4.75V to 5.25V, with a typical operating temperature range of -40°C to 85°C.
PackageHVQFN EP
MountingSurface Mount
Quick Jump:
Technical Specifications
NXP BGX7100HN/1,118 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
HVQFN EP
Package Description
Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad
Lead Shape
No Lead
Pin Count
24
PCB
24
Package Length (mm)
4.1(Max)
Package Width (mm)
4.1(Max)
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-220
Device Type
Modulator
Maximum I/Q Frequency
4000MHz
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Programmability
No
Min Operating Supply Voltage
4.75V
Typical Operating Supply Voltage
5V
Max Operating Supply Voltage
5.25V
Typical Output Power
20dBm
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP BGX7100HN/1,118 Datasheet
Download the complete datasheet for NXP BGX7100HN/1,118 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.