Surface mount modulator IC operating up to 4GHz, featuring a 24-pin HVQFN EP package with an exposed pad for thermal enhancement. This non-lead-frame SMT component has a 0.5mm pin pitch and measures 4.1mm x 4.1mm x 0.95mm. It offers a typical output power of 20 dBm and operates within a supply voltage range of 4.75V to 5.25V, with a typical of 5V. Designed for surface mounting, this plastic package adheres to the MO-220 Jedec standard and functions across an industrial temperature range of -40°C to 85°C.
PackageHVQFN EP
MountingSurface Mount
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Technical Specifications
NXP BGX7101HN/1 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
HVQFN EP
Package Description
Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad
Lead Shape
No Lead
Pin Count
24
PCB
24
Package Length (mm)
4.1(Max)
Package Width (mm)
4.1(Max)
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-220
Device Type
Modulator
Maximum I/Q Frequency
4000MHz
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Programmability
No
Min Operating Supply Voltage
4.75V
Typical Operating Supply Voltage
5V
Max Operating Supply Voltage
5.25V
Typical Output Power
20dBm
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP BGX7101HN/1 Datasheet
Download the complete datasheet for NXP BGX7101HN/1 to view detailed technical specifications.
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