The BU2530AW,127 is a NPN bipolar junction transistor packaged in a TO-247 outline with three through-hole leads. It has a maximum package length of 15.75mm, width of 5.2mm, and height of 20.6mm, and is made of plastic material. The transistor is suitable for through-hole mounting on a printed circuit board.
PackageTO-247
MountingThrough Hole
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Technical Specifications
NXP BU2530AW,127 technical specifications.
General
| Basic Package Type | Through Hole |
| Package Family Name | TO-247 |
| Package/Case | TO-247 |
| Package Description | Transistor Outline Package |
| Lead Shape | Through Hole |
| Pin Count | 3 |
| PCB | 3 |
| Tab | Tab |
| Package Length (mm) | 15.75(Max) |
| Package Width (mm) | 5.2(Max) |
| Package Height (mm) | 20.6(Max) |
| Package Material | Plastic |
| Mounting | Through Hole |
| Jedec | TO-247 |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP BU2530AW,127 Datasheet
Download the complete datasheet for NXP BU2530AW,127 to view detailed technical specifications.
No datasheet is available for this part.