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Technical Specifications
NXP BU508DW,127 technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
TO-247
Package/Case
TO-247
Package Description
Transistor Outline Package
Lead Shape
Through Hole
Pin Count
3
PCB
3
Tab
Tab
Package Length (mm)
15.75(Max)
Package Width (mm)
5.2(Max)
Package Height (mm)
20.6(Max)
Package Material
Plastic
Mounting
Through Hole
Jedec
TO-247
Compliance
Cage Code
H1R01
EU RoHS
Yes
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP BU508DW,127 Datasheet
Download the complete datasheet for NXP BU508DW,127 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.