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Technical Specifications
NXP BUK9609-55A,118 technical specifications.
General
| Package/Case | SOT |
| Contact Plating | Tin |
| Continuous Drain Current (ID) | 108A |
| Drain to Source Breakdown Voltage | 55V |
| Drain to Source Resistance | 8mR |
| Drain to Source Voltage (Vdss) | 55V |
| Fall Time | 131ns |
| Gate to Source Voltage (Vgs) | 15V |
| Input Capacitance | 2.39nF |
| Max Dual Supply Voltage | 55V |
| Max Operating Temperature | 175°C |
| Min Operating Temperature | -55°C |
| Max Power Dissipation | 150W |
| Package Quantity | 1 |
| Packaging | Tape and Reel |
| Polarity | N-CHANNEL |
| Power Dissipation | 211W |
| Rds On Max | 63mR |
| RoHS Compliant | Yes |
| Series | TrenchMOS™ |
| Turn-Off Delay Time | 197ns |
| Turn-On Delay Time | 22ns |
Compliance
| RoHS | Compliant |
Datasheet
NXP BUK9609-55A,118 Datasheet
Download the complete datasheet for NXP BUK9609-55A,118 to view detailed technical specifications.
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