Voltage33V
MountingSurface Mount
Power500mW
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Technical Specifications
NXP BZV55-B33,115 technical specifications.
General
| Impedance | 80R |
| Max Operating Temperature | 200°C |
| Min Operating Temperature | -65°C |
| Max Power Dissipation | 500mW |
| Max Reverse Leakage Current | 50nA |
| Mount | Surface Mount |
| Package Quantity | 2500 |
| Packaging | Cut Tape |
| Power Dissipation | 500mW |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Tolerance | 2% |
| Voltage | 33V |
| Voltage Tolerance | 2% |
| Zener Voltage | 33V |
Compliance
| RoHS | Compliant |
Datasheet
NXP BZV55-B33,115 Datasheet
Download the complete datasheet for NXP BZV55-B33,115 to view detailed technical specifications.
No datasheet is available for this part.