PackageDO-35
MountingThrough Hole
Power500mW
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Technical Specifications
NXP BZX79-B2V7,113 technical specifications.
General
| Package/Case | DO-35 |
| Contact Plating | Tin |
| ESD Protection | No |
| Impedance | 100R |
| Lead Free | Lead Free |
| Max Operating Temperature | 200°C |
| Min Operating Temperature | -65°C |
| Max Power Dissipation | 400mW |
| Max Reverse Leakage Current | 20uA |
| Mount | Through Hole |
| Package Quantity | 10000 |
| Packaging | Tape and Reel |
| Power Dissipation | 500mW |
| RoHS Compliant | Yes |
| Tolerance | 2% |
| Voltage Tolerance | 2% |
| Zener Voltage | 2.7V |
Compliance
| RoHS | Compliant |
Datasheet
NXP BZX79-B2V7,113 Datasheet
Download the complete datasheet for NXP BZX79-B2V7,113 to view detailed technical specifications.
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