PackageDFN
MountingSurface Mount
Power250mW
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Technical Specifications
NXP BZX884-C30,315 technical specifications.
General
Package/Case
DFN
Contact Plating
Tin
ESD Protection
Yes
Impedance
80R
Max Operating Temperature
150°C
Min Operating Temperature
-65°C
Max Power Dissipation
250mW
Max Reverse Leakage Current
50nA
Mount
Surface Mount
Package Quantity
1
Packaging
Tape and Reel
Power Dissipation
250mW
RoHS Compliant
Yes
Tolerance
5%
Voltage Tolerance
5%
Zener Voltage
30V
Compliance
RoHS
Compliant
Datasheet
NXP BZX884-C30,315 Datasheet
Download the complete datasheet for NXP BZX884-C30,315 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.