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Technical Specifications
NXP CBT16212DGG technical specifications.
General
| Package/Case | TSSOP |
| Lead Free | Lead Free |
| Low Level Output Current | 128mA |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Max Supply Voltage | 5.5V |
| Min Supply Voltage | 4V |
| Mount | Surface Mount |
| Number of Elements | 1 |
| Number of Inputs | 24 |
| Number of Outputs | 24 |
| Operating Supply Voltage | 5V |
| Package Quantity | 35 |
| Packaging | Rail/Tube |
| Propagation Delay | 0.25ns |
| Quiescent Current | 3uA |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Technology | CMOS |
| Throw Configuration | DPDT |
| Turn-On Delay Time | 8ns |
Compliance
| RoHS | Compliant |
Datasheet
NXP CBT16212DGG Datasheet
Download the complete datasheet for NXP CBT16212DGG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.